Patent attributes
A fingerprint identification module including a cover plate, a fingerprint identification sensor, a first adhesive layer, and at least one light source is provided. The cover plate has an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface. The fingerprint identification sensor is located under the microstructures and attached to the microstructures through the first adhesive layer, wherein the first adhesive layer is adhered between a portion of the microstructures and a portion of the fingerprint identification sensor, and an air gap is located between the other portion of the microstructures and the other portion of the fingerprint identification sensor. The at least one light source is located under the inner surface and adjacent to the fingerprint identification sensor.
