Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yongsik Yu0
Nagraj Shankar0
Bart J. van Schravendijk0
Bhadri N. Varadarajan0
Date of Patent
June 19, 2018
0Patent Application Number
154082910
Date Filed
January 17, 2017
0Patent Citations Received
0
...
Patent Primary Examiner
0
Patent abstract
Methods and apparatuses for depositing an encapsulation layer over a staircase structure during fabrication of a 3D NAND structure to prevent degradation of an oxide-oxide interface and to prevent punchthrough of a wordline are provided. The encapsulation layer is a carbon-containing conformal film deposited over a staircase structure of alternating oxide and nitride layers prior to depositing oxide over the staircase structure.
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