Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 26, 2018
Patent Application Number
15215800
Date Filed
July 21, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a substrate and a semiconductor element mounted on the top surface of the substrate. On the top surface of the substrate, one or more pads are disposed outside the mounted semiconductor element when seen in a plan view. Then, a protrusion is disposed on each of the pads. A heat sink is disposed above the semiconductor element and the protrusions, and then bonded to the substrate by an adhesive provided between the heat sink and the substrate. The adhesive is provided in such a manner as to be in contact with the protrusions on the substrate.
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