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US Patent 10008485 Semiconductor device and method of manufacture

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 24, 2017
Date of Patent
June 26, 2018
Patent Application Number
15495494
Patent Citations Received
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US Patent 10763132 Release film as isolation film in package
0
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US Patent 11488843 Underfill between a first package and a second package
0
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US Patent 11756802 Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device
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US Patent 10170341 Release film as isolation film in package
Patent Inventor Names
Porter Chen
0
Jing-Cheng Lin
0
Li-Hui Cheng
0
Po-Hao Tsai
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10008485
Patent Primary Examiner
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Fernando L Toledo

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