Patent attributes
Provided are methods for cleaning processing tools from residue using laser ablation. Also provided are processing tools comprising non-metal base portions and protective optical layers that cover and shield these base portions from laser ablation. For example, a protective optical layer may reflect a laser beam used for ablating the tool. Methods of forming these protective optical layers on non-metal base portions are also provided. In some embodiments, this protective optical layer is the outermost layer exposed to the environment. Alternatively, the protective optical layer may be covered by a release layer. The release layer may be retained or removed during laser ablation. In some embodiments, light emitted by a processing tool during laser ablation is analyzed to determine performance of its protective optical layer. This feedback may be used to control the laser ablation such as to control orientation of the laser beam relative to the processing tool.
