Log in
Enquire now
‌

US Patent 10018560 System and method for hyperspectral imaging metrology

Patent 10018560 was granted and assigned to KLA-Tencor on July, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
KLA-Tencor
KLA-Tencor
0
Date Filed
August 10, 2016
0
Date of Patent
July 10, 2018
0
Patent Applicant
KLA-Tencor
KLA-Tencor
0
Patent Application Number
15233648
0
Patent Citations Received
‌
US Patent 10401738 Overlay metrology using multiple parameter configurations
Patent Inventor Names
Andrew V. Hill
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
10018560
0
Patent Primary Examiner
‌
William R Alexander
0

Find more entities like US Patent 10018560 System and method for hyperspectral imaging metrology

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us