Patent attributes
The disclosed technology provides an enclosure system for computing equipment and a method for manufacturing an enclosure system, which includes a front enclosure base configured to secure a plurality of tray modules, each of the plurality of tray modules comprising a printed circuit board to connect a plurality of electronic components and being connected at a rear end to a connectivity midplane. The front enclosure base has a front end taller than the rear end such that the front end is configured to structurally support the plurality of tray modules and the rear end allows connecting rear faces of each of the plurality of tray modules to the connectivity midplane.