Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Date of Patent
July 17, 2018
Patent Application Number
15668315
Date Filed
August 3, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A package includes a device die, a molding material molding the device die therein, a through-via substantially penetrating through the molding material, wherein the through-via has an end. The end of the through-via is tapered and has rounded sidewall surfaces. The package further includes a redistribution line electrically coupled to the through-via.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
