US Patent 10037946 Package structure having embedded bonding film and manufacturing method thereof

A package structure having an embedded bonding film including a redistribution substrate, a bonding film and a core is provided. The redistribution substrate has a top side and a bottom side opposite to the top side. The bonding film disposed at the top side and embedded in the redistribution substrate includes at least one bonding area and a metal circuit is disposed within the bonding area. The bonding area includes an outer top metal pad electrically coupled to an outer end of the metal circuit and an inner top metal pad on a top surface of the bonding film within the bonding area and electrically coupled to an inner end of the metal circuit. The core disposed at the bottom side of the redistribution substrate and electrically coupled to the redistribution substrate. A Young's modulus of the core is greater than a Young's modulus of the redistribution substrate.