Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yeoung Beom Ko0
Hee Sung Kim0
Jae Jin Lee0
Joon Dong Kim0
Dae Byoung Kang0
Dong Jean Kim0
Date of Patent
July 31, 2018
Patent Application Number
15447831
Date Filed
March 2, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
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