US Patent 10043787 Optoelectronic chip embedded organic substrate

Optoelectronic devices and method of forming the same include an optoelectronic chip in a substrate layer, the optoelectronic chip having one or more optoelectronic components. An integrated circuit chip is positioned on the substrate layer. A lens array is positioned on the substrate layer above the optoelectronic chip and above at least part of the integrated circuit chip. The lens array includes one or more lens positioned directly respective optoelectronic components.