US Patent 10045436 Printed circuit board and method of manufacturing the same
Patent 10045436 was granted and assigned to Samsung on August, 2018 by the United States Patent and Trademark Office.
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Patent abstract
A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.
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Patent Jurisdiction
Patent Number
100454360
Date of Patent
August 7, 2018
0Patent Application Number
145379980
Date Filed
November 11, 2014
0Patent Citations Received
Patent Primary Examiner
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
100454360
Date of Patent
August 7, 2018
0Patent Application Number
145379980
Date Filed
November 11, 2014
0Patent Citations Received
Patent Primary Examiner
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Patent citations received
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US Patent 10045436 Printed circuit board and method of manufacturing the same
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
10045436
Date of patent
August 7, 2018
Patent application number
14537998
Date Filed
November 11, 2014
Patent primary examiner
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