Patent 10054371 was granted and assigned to Aavid Thermalloy on August, 2018 by the United States Patent and Trademark Office.
A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.