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US Patent 10054745 Photonic integration platform
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Patent
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Date Filed
March 17, 2017
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Date of Patent
August 21, 2018
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Patent Application Number
15461789
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Patent Citations Received
US Patent 11910568 Heat dissipation system with microelectromechanical system (MEMS) for cooling electronic or photonic components
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US Patent 10877229 Edge coupling through unetched surface of photonic chip
US Patent 11275211 Fiber array unit with unfinished endface
US Patent 11693200 Double bonding when fabricating an optical device
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US Patent 11906385 Photonic device, method for operating a photonic device and method for manufacturing a photonic device
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Patent Inventor Names
Mark Webster
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Ravi Sekhar Tummidi
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10054745
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Patent Primary Examiner
Kaveh C Kianni
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