Patent attributes
Multilayer structure, including a substrate film having a first and second opposite side, said substrate film including electrically insulating material, conductive traces on the first side of the substrate film for establishing a predetermined circuit design, a connector element laid upon the first side of, said substrate film, one side of the connector element facing the structure internals and the other, opposite side facing the environment on the second side of the substrate film including a number of electrically conductive contact members electrically connected to the circuit on the first side of the substrate film and configured to contact one or more electrical contact members of an external element responsive to mating the external element with the connector element, and a plastic layer molded onto the substrate film and the connector element so as to cover said one side of the connector element and the circuit.
