Patent 10058154 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on August, 2018 by the United States Patent and Trademark Office.
A method of manufacturing a protective cover for an electronic device is disclosed. The method includes forming an inner skin by blanking, blanking an outer skin of a fabric member in a shape corresponding to the blanked inner skin, forming a preform of a protective cover by laminating the inner skin and the outer skin with each other, thermo-compressing the laminated preform along an outer peripheral edge of the protective cover and forming the protective cover by cutting at least a portion of a region where the preform is thermo-compressing by the blanking.