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US Patent 10062651 Packaging substrate and electronic package having the same

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Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

August 28, 2018

Patent Application Number

15063592

Date Filed

March 8, 2016

Patent Citations Received

US Patent 11394386 Logic drive using standard commodity programmable logic IC chips

US Patent 11749610 Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip

US Patent 11309334 Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells

US Patent 11368157 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

US Patent 11227838 Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits

US Patent 11545477 Logic drive based on standardized commodity programmable logic semiconductor IC chips

US Patent 10819345 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

US Patent 10886924 Logic drive using standard commodity programmable logic IC chips

...

Patent Primary Examiner

Patent abstract

A packaging substrate is provided, which includes: a substrate body having a first region with a plurality of conductive pads and a second region adjacent to the first region, and a material layer formed on the second region to prevent the substrate body from warping. An electronic package having the packaging substrate is also provided.

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