Patent 10067408 was granted and assigned to SZ DJI Technology Co. Ltd. on September, 2018 by the United States Patent and Trademark Office.
An image capturing module including a casing, a camera unit disposed in the casing, a circuit board device connected to the camera unit and disposed in the casing, and a heat dissipation device. The circuit board device includes a circuit board unit disposed at a periphery of the camera unit and including a functional module. The heat dissipation device includes a heat sink attached on a surface of the functional module for dissipating heat from the functional module.