Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hemant Bheda0
Riley Reese0
Date of Patent
September 4, 2018
0Patent Application Number
150694400
Date Filed
March 14, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A system and method for additive manufacturing of otherwise thermosetting polymers, such as PAI, is disclosed. The system includes fast-curing hardware that facilitates curing each deposited layer before a successive layer is deposited. This reduces the time to provide a finished part from weeks to hours.
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