Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Motoharu Haga0
Kaoru Yasuda0
Date of Patent
September 4, 2018
Patent Application Number
15479887
Date Filed
April 5, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a semiconductor substrate with a wiring layer formed thereon, an insulating film formed on the semiconductor substrate so as to cover the wiring layer and having a pad opening exposing a portion of the wiring layer as a pad, a front surface protection film formed on the insulating film and being constituted of an insulating material differing from the insulating film and having a second pad opening securing exposure of at least a portion of the pad, a seed layer formed on the pad, and a plating layer formed on the seed layer.
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