Patent 10075573 was granted and assigned to LG on September, 2018 by the United States Patent and Trademark Office.
A conductive trace design is described that minimizes the possibility of crack initiation and propagation in conductive traces during bending. The conductive trace design has a winding trace pattern that is more resistant to the formation of cracks at high stress points in the conductive traces. The conductive trace design includes a cap that helps ensure electrical connection of the conductive trace even though one or more cracks may begin to form in the conductive portion of the conductive trace.