Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 18, 2018
Patent Application Number
15443347
Date Filed
February 27, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of manufacturing a semiconductor package including coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), placing a solder ball on the connection pad coated with the flux, forming a solder layer attached to the connection pad from the solder ball through a reflow process, and mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip may be provided.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.