Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kuo-Chun Hsieh0
Date of Patent
September 25, 2018
0Patent Application Number
145388190
Date Filed
November 12, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A heat pipe structure includes a main body. The main body has a first board body, a second board body, a capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other to hold the capillary structure. The capillary structure is formed with at least one passage. One of the first and second board bodies is formed with a protrusion section protruding toward the capillary structure. The protrusion section is attached to the capillary structure in adjacency to the passage. Accordingly, the heat pipe structure has an extremely thin thickness.
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