US Patent 10083927 Chip package structure with bump
Is a
Date Filed
December 29, 2017
0
Date of Patent
September 25, 2018
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Patent Application Number
15857976
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Patent Citations Received
Patent Inventor Names
Hsien-Wei Chen
0
An-Jhih Su
0
Li-Hsien Huang
0
Wei-Yu Chen
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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