Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
September 25, 2018
Patent Application Number
15589370
Date Filed
May 8, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
Devices, methods, and systems for ion trapping are described herein. One device includes a through-silicon via (TSV) and a trench capacitor formed around the TSV.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.