US Patent 10085352 Method for manufacturing an integrated circuit package
Patent 10085352 was granted and assigned to Qorvo on September, 2018 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 1, 2015
0
Date of Patent
September 25, 2018
0
Patent Applicant
Patent Application Number
14872910
0
Patent Inventor Names
Baker Scott
0
Dirk Robert Walter Leipold
0
George Maxim
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Julio C. Costa
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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