US Patent 10090162 Plasma processing method and plasma processing device
Patent 10090162 was granted and assigned to Hitachi on October, 2018 by the United States Patent and Trademark Office.
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Patent abstract
Controllability of ion bombardment on a substrate is further improved to achieve uniformity of the etched substrate across the substrate surface.
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Patent Applicant
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Patent Jurisdiction
Patent Number
100901620
Date of Patent
October 2, 2018
0Patent Application Number
155564550
Date Filed
November 2, 2016
0Patent Citations Received
Patent Primary Examiner
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
100901620
Date of Patent
October 2, 2018
0Patent Application Number
155564550
Date Filed
November 2, 2016
0Patent Citations Received
Patent Primary Examiner
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Golden AI
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Patent Citations Received
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Patent citations received
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US Patent 10090162 Plasma processing method and plasma processing device
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10090162
Date of patent
October 2, 2018
Patent application number
15556455
Date Filed
November 2, 2016
Patent primary examiner
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