US Patent 10090296 Semiconductor device, manufacturing method thereof, and electronic apparatus
Patent 10090296 was granted and assigned to Sony on October, 2018 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device includes a wiring layer that includes at least one low-dielectric rate interlayer insulating film layer; a guard ring that is formed by placing in series a wire and a via so as to be in contact with a through electrode, in a portion in which the through electrode passing through the wiring layer is formed; and the through electrode that is formed by being buried inside the guard ring.
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Patent Citations Received
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Is a
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
100902960
Date of Patent
October 2, 2018
0Patent Application Number
158614970
Date Filed
January 3, 2018
0Patent Citations Received
Patent Primary Examiner
Edits on 8 Feb, 2023
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Infobox
Patent Citations Received
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
100902960
Date of Patent
October 2, 2018
0Patent Application Number
158614970
Date Filed
January 3, 2018
0Patent Primary Examiner
Edits on 22 Jan, 2022
Golden AI
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US Patent 10090296 Semiconductor device, manufacturing method thereof, and electronic apparatus
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10090296
Date of patent
October 2, 2018
Patent application number
15861497
Date Filed
January 3, 2018
Patent primary examiner
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