Patent attributes
A camera module assembly including a circuit carrier substrate having a first region integrally formed with a second region, the second region being movable with respect to the first region. The camera module assembly may further include an image sensor device positioned within a cavity formed in the first region of the circuit carrier substrate. The image sensor device may have a conductive via and a redistribution layer formed therein. The conductive via and the redistribution layer are electrically connected to the circuit carrier substrate along the side of the image sensor device facing the circuit carrier substrate. The camera module assembly further includes an electronic component positioned within a second cavity formed in the first region, the electronic component being electrically connected to the circuit carrier substrate.
