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US Patent 10091033 Multilevel driver for high speed chip-to-chip communications

Patent 10091033 was granted and assigned to Kandou on October, 2018 by the United States Patent and Trademark Office.

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Patent abstract

Transmission line driver systems are described which are comprised of multiple paralleled driver elements. The paralleled structure allows efficient generation of multiple output signal levels with adjustable output amplitude, optionally including Finite Impulse Response signal shaping and skew pre-compensation.

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