US Patent 10096515 Interconnect structure for stacked device
Is a
Date Filed
July 8, 2013
Date of Patent
October 9, 2018
Patent Application Number
13937055
Patent Citations Received
Patent Inventor Names
Shu-Ting Tsai
0
Jeng-Shyan Lin
0
Sheng-Chau Chen
0
Shih-Pei Chou
0
Chia-Chieh Lin
0
Chih-Hui Huang
0
Dun-Nian Yaung
0
Feng-Chi Hung
0
Jen-Cheng Liu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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