US Patent 10101097 Heat sink having thermal distortion compensation

A bonded dissimilar material heat transfer assembly is provided. The assembly comprises a frame component, a thin stamped component and at least one dissimilar metal component having means for heat transfer and having a higher thermal conductivity than the frame component and stamped component. The heat transfer assembly includes a novel geometry such that distortion caused by mismatch of thermal expansion rates does not affect the normally planar shape of the assembly. Such a construction leads to higher thermal performance, lighter weight, less cost, and higher reliability than similar prior art heat exchanger assemblies.