US Patent 10104764 Electronic device package with vertically integrated capacitors

A system-in-a-package (SIP) has a semiconductor chip embedded in a dielectric substrate. An inductor is on a top surface of a substrate and is connected to the semiconductor chip. A thin film capacitor may be placed between the inductor and the dielectric substrate. A second thin film capacitor may be placed on the top surface of the semiconductor chip, or be embedded in the dielectric substrate with a thermal pad on a bottom surface of the substrate which is connected to the second thin film capacitor to facilitate heat dissipation.