US Patent 10109421 Polymerization method for preparing conductive polymer
Patent 10109421 was granted and assigned to Kemet Electronics Corporation on October, 2018 by the United States Patent and Trademark Office.
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Patent abstract
A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
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Patent Inventor Names
Antony P Chacko0
John Ols0
Yaru Shi0
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
101094210
Date of Patent
October 23, 2018
0Patent Application Number
146616620
Date Filed
March 18, 2015
0Patent Citations Received
Patent Primary Examiner
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US Patent 10109421 Polymerization method for preparing conductive polymer
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10109421
Date of patent
October 23, 2018
Patent application number
14661662
Date Filed
March 18, 2015
Patent primary examiner
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