Patent attributes
A flip chip pressure sensor assembly. The flip chip pressure sensor assembly comprises a substrate; a pressure sensor die comprising a sensing diaphragm, the die having a top side and a bottom side that is reverse to the top side, where the top side of the die is electrically connected to the substrate by flip chip mounting technology; a cover defining an aperture disposed over the pressure sensor die, where the aperture defined by the cover aligns with the sensing diaphragm to provide a path for pressure to be transmitted through the aperture to the bottom side of the sensing diaphragm; and a gel disk disposed within the aperture in intimate contact with a bottom side of the sensing diaphragm, where the gel disk is domed above an outer shoulder of a rim defined by the cover.
