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US Patent 10115647 Non-vertical through-via in package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 16, 2015
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Date of Patent
October 30, 2018
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Patent Application Number
14658968
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Patent Citations Received
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US Patent 11393793 Thin semiconductor package
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US Patent 10636757 Integrated circuit component package and method of fabricating the same
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US Patent 11600590 Semiconductor device and semiconductor package
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US Patent 11676932 Semiconductor interconnect structures with narrowed portions, and associated systems and methods
0
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US Patent 11302572 Semiconductor package and method of manufacturing the same
Patent Inventor Names
Jing-Cheng Lin
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Cheng-Lin Huang
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Jy-Jie Gau
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Jung-Hua Chang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10115647
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Patent Primary Examiner
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S. V. Clark
0

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