Patent attributes
An electronic apparatus includes a transmission line member and a mount circuit board. The transmission line member includes a dielectric base body, a first signal conductor, a first ground conductor, a second ground conductor, and a first transmission line that transmits a first high frequency signal and is defined by the first signal conductor interposed between the first and second ground conductors. The mount circuit board is wrapped by the transmission line member such that the transmission line member covers the mount circuit board from a top surface to a back surface via a side surface of the mount circuit board. At least one of an IC chip, a mount component, and a battery pack is mounted on the mount circuit board and is wrapped by the transmission line member so as to be disposed on an inner peripheral side of the transmission line member.
