Patent attributes
Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1<T2). A first heat exchanger is immersed in a surface layer portion of the second cooling liquid within the cooling tank. The first heat exchanger encloses therein a third refrigerant having a boiling point T3 (provided T1=T3 or T1>T3).
