US Patent 10123464 Heat dissipating system
Patent 10123464 was granted and assigned to Hewlett Packard Enterprise on November, 2018 by the United States Patent and Trademark Office.
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Patent abstract
Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.
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Patent Inventor Names
David A Moore0
John P Franz0
Michael L Sabotta0
Tahir Cader0
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US Patent 10123464 Heat dissipating system
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Is a
Current assignee
Patent jurisdiction
Patent number
10123464
Date of patent
November 6, 2018
Patent application number
14376124
Date Filed
February 9, 2012
Patent primary examiner
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