Patent attributes
A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.