US Patent 10126616 Electronic device

According to one embodiment, an electronic device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement opposed to the first basement and the first conductive layer, and a second conductive layer, a sealing material located between the first substrate and the second substrate to bond the first substrate to the second substrate, a contact hole penetrating the second basement, the sealing material and the first conductive layer, and a connecting material electrically connecting the first conductive layer with the second conductive layer via the contact hole.