US Patent 10128165 Package with vertically spaced partially encapsulated contact structures
Patent 10128165 was granted and assigned to Infineon Technologies on November, 2018 by the United States Patent and Trademark Office.
Name
# Contributions
Last Contribution
Find more entities like US Patent 10128165 Package with vertically spaced partially encapsulated contact structures
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
