US Patent 10128175 Packaging methods and packaged semiconductor devices

Packaging methods and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes forming first contact pads on a carrier, forming a wiring structure over the first contact pads, and forming second contact pads over the wiring structure. A first packaged semiconductor device is coupled to a first set of the second contact pads, and a second packaged semiconductor device is coupled to a second set of the second contact pads. The carrier is removed. The second packaged semiconductor device comprises a different package type than the first packaged semiconductor device.