Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 13, 2018
Patent Application Number
15430667
Date Filed
February 13, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
In one example, a method for fabricating an integrated circuit includes patterning a layer of a first conductive metal, via a subtractive etch process, to form a plurality of lines for connecting semiconductor devices on the integrated circuit. A large feature area is formed outside of the plurality of conductive lines via a metal fill process using a second conductive metal.
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