Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Poh Boon Yong0
Date of Patent
November 20, 2018
Patent Application Number
14829503
Date Filed
August 18, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
Defect inspection methods and systems that use process conditions to dynamically determine how to perform defect inspections during a semiconductor manufacturing process are disclosed. A defect inspection method may include: obtaining process conditions from a process tool utilized to process at least one wafer; determining whether to perform defect inspection of a layer, a wafer, or a high risk area/spot within the at least one wafer based on the process conditions obtained; bypassing the defect inspection when it is determined not to perform the defect inspection; and performing the defect inspection after the at least one wafer is processed by the process tool when it is determined to perform the defect inspection.
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