Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroaki Kusa0
Tamami Takahashi0
Masaya Seki0
Kazuaki Maeda0
Date of Patent
November 27, 2018
Patent Application Number
15485446
Date Filed
April 12, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
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