Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jung Wei Cheng0
Chi-Yang Yu0
Chien-Hsun Lee0
Chin-Liang Chen0
Chen-Hua Yu0
Date of Patent
November 27, 2018
Patent Application Number
14470666
Date Filed
August 27, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
Integrated circuit packages and methods of forming the same are disclosed. A first die is mounted on a first side of a package substrate. A heat dissipation feature is attached on a first side of the first die. A second die is mounted on a second side of the first die, wherein the second die is at least partially disposed in a through hole formed in the package substrate. An encapsulant is formed on the first side of the package substrate around the first die.
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