US Patent 10141237 Fingerprint recognition module and manufacturing method therefor

This application provides a fingerprint recognition module and a manufacturing method therefor. The fingerprint recognition module includes a flexible printed circuit (FPC) board, a die, an adhesive layer, and a cover plate. The manufacturing method includes the following steps: (a) directly welding the die to the FPC board, and electrically connecting the die to the FPC board; (b) coating the adhesive layer on an upper surface of the die; (c) covering the adhesive layer with a cover plate, to adhere the cover plate to the adhesive layer; and (d) applying low pressure injection modeling encapsulation to an encapsulation space defined between the cover plate and the FPC board, so as to form an encapsulation layer in the encapsulation space and produce a waterproof effect.