US Patent 10141254 Direct bonded copper power module with elevated common source inductance

A direct bonded copper (DBC) power module with elevated common source inductance is adapted for use as a half bridge in an electric drive for an electric vehicle. Etching patterns on the DBC substrates provide indented notches for concentrating magnetic flux in the power loops. Etched gate traces form gate loops with coil windings disposed within or overlapping the notches in order to enhanced the common source inductance for each switching transistor (such as an IGBT). Switching loss is reduced and fuel economy is improved for the electric vehicle with minimal impact on packaging size and at no additional cost.