US Patent 10141446 Formation of bottom junction in vertical FET devices

Formation of a bottom junction in vertical FET devices may include, for instance, providing an intermediate semiconductor structure comprising a semiconductor substrate, a fin disposed on the semiconductor substrate. The fin has a top surface, spaced-apart vertical sides. A mask is disposed over the top surface of the fin, and at least one is disposed over the vertical sides of the fin. Portions of the substrate are removed to define spaced-apart recesses each extending below a respective one of the spacers. Semiconductor material is grown, such as epitaxially grown, in the recesses.